Curing System - Tunnel Oven
Used in the curing process after E'less plating / flash-etching / developing for IC substrate
Application
IC Substrate, Glass Cores, etc.
Features
1. To clamp only three sides to prevent warpage through the process
2. Spring tension monitoring in real time
3. Temperature uniformity: ±2℃.
2. Spring tension monitoring in real time
3. Temperature uniformity: ±2℃.
Main Specs.
|
Size |
410*510~513*623mm · Customizable |
|
Thickness |
0.035 ~2.0mm |
|
Productivity |
≤ 17s/piece |
|
Board Weight |
≤ 2kg |
|
Operation Temperature |
≤ 180℃±3℃/ 60min |
|
Heater |
PIN Heater(60Kw, 186Kw) |
|
UV Lamp |
Metal halide lamp |
| UV Energy | 2000mj / cm² |
